Electronics in the third dimension

Additive manufacturing opens up a whole new world of product designs, functionalities and production possibilities for the electronics industry. The Electronics & Components Forum on 14 May 2025 takes a look at where these technologies currently stand in terms of industrial readiness. It is the first ever forum dedicated exclusively to this topic at rapid.tech 3D. The partner of the trade forum is 3-D MID e.V., the research association for the promotion, development and marketing of three-dimensional mechatronic integrated devices (MIDs).

3D-printed electronics: An innovative field with increasing application readiness

The new trade forum covers a wide range of topics, including current research in mechatronic integrated devices and the 3D printing of technical plastic parts for electronic components such as bobbins. It also examines additive manufacturing with dielectric materials, for example for high-frequency technology, and sheds light on flexible and printed photovoltaics and 3D printing for ultra-precise micro-scale joining technology. “Recently there have been many innovations in 3D-printed electronics, with new approaches that are increasingly ready for application. This doesn’t just mean printed structures, but also complete components such as chips, sensors, LEDs and microprocessors. We want to present these developments to the audience in Erfurt and discuss further approaches together,” explains Wolfgang Mildner, CEO of the consulting and technology company MSWtech and member of the rapid.tech 3D advisory board. He has designed the content of the new forum and is delighted about the partnership with 3-D MID e.V. “We have been in close contact with the association for many years and have now taken our collaboration to a new level.”

Additive mechatronics: Added value for MIDs

To kick things off, Prof. Dr Florian Risch, Managing Director of the 3-D MID e.V. research association and Professor of Assembly Technologies for Electrical Energy Storage at the Friedrich-Alexander University Erlangen-Nuremberg, will give an insight into innovative application fields and technologies for mechatronic integrated devices. MIDs combine mechanical, electrical, thermal, optical and/or fluidic functions and offer advantages such as miniaturisation, design flexibility and greater efficiency. They are used in the automotive industry, medical technology, consumer goods and networked manufacturing, where they pave the way to smart and multifunctional solutions. The additive manufacturing of mechatronic systems (additive mechatronics) in particular opens up new possibilities through bespoke designs and functional integration.

Metal and polymer 3D printing in electronics engineering

Pairing up with Dr Johannes Lohn, Director Development, Marketing & Sales at 3D printing service provider PROTIQ, Maximilian Ruoff, Head of the Industrial Additive Manufacturing division at Weisser Spulenkörper, will explain how the company can benefit from 3D printing in the production of bobbins and boxes for sensors, magnets and transformers. The two speakers share their thoughts on the possibilities and limitations of metal and polymer 3D printing in electronics engineering. They also look at materials aspects such as the handling of copper, as well as flame retardancy and ESD (electrostatic discharge).

Innovative 3D printing materials for high-frequency applications

Guillaume de Calan, co-founder and CEO of Nanoe, talks about the additive manufacturing of dielectric material for high-frequency applications. The French company specialises in the development and manufacture of innovative ceramic materials for industry. Nanoe’s printable dielectric materials enable new designs and new functions to be developed for high-frequency components such as antennas and radar systems.

The potential of emerging PV

Dr Jens Hauch, head of the research unit High Throughput Methods in Photovoltaics at the Helmholtz Institute Erlangen-Nuremberg and manager of the SolarTAP initiative, will discuss the bright future of emerging PV, i.e. up-and-coming new photovoltaic technologies. Emerging PV are ideal for integrating into other applications, as they can be printed at low temperatures on flexible, lightweight substrates as well as on surfaces with a 3D curvature. Their use in agrivoltaics, building-integrated photovoltaics and internet-of-things applications is particularly promising; these technologies are an interesting alternative to batteries in this respect.

Overview of current innovations for additive and 3D electronics

Current technical innovations for additive and 3D electronics are the subject of the presentation by Khasha Ghaffarzadeh, CEO of TechBlick. The company is regarded as a leader in the analysis of new technologies and materials. TechBlick has created a global platform for training, networking and learning in the field of printed electronics and electronics materials, offering various virtual and on-site event formats.

Precision printing of conductive materials

The Polish company XTPL has developed an additive manufacturing technology for the ultra-precise dispensing of nanomaterials. The core component is an innovative printing head, which enables conductive materials to be applied in ultra-fine patterns, creating high-resolution electronic components such as those required in semiconductor production or for displays or biosensors. The company will be showcasing its technology and various application scenarios in Erfurt.

Specialist conference offers a look at other current AM developments and applications

Alongside the Electronics & Components trade forum, other forums at the rapid.tech 3D specialist conference provide insights into the latest AM developments and applications. On the first day, the VDMA AM4industry Forum, the Aerospace Forum and the quality-approved Science Forum invite visitors to delve into these topics. Day two of the programme includes the Chemistry & Process Engineering and Mobility forums in addition to the Electronics & Components Forum. The final day sees the forums Energy Technology & Hydrogen, Software, AI & Design and Innovation in AM welcome participants.

Presentations and a chance to chat to exhibitors, Deep Dive tours and Expert Tables

Visitors can also look forward to product and service demonstrations as well as small group discussions in Hall 2 – at the exhibitors’ stands or on guided Technical Deep Dive tours, at the Expert Tables, and at the AM Science Poster Slam in the hall.

The 3D Pioneers Challenge too is a source of inspiration, introducing completely new applications of additive and digital technologies. This year the international competition is back at rapid.tech 3D for the tenth time. The anniversary edition will present the 2025 finalists and see the winners announced. Plus, all previous finalists and winners are encouraged to return for another chance to scoop an award from the jury.