Interview with Wolfgang Mildner

Mr. Mildner, why was the new Electronics & Components Forum included in the program?
    
Recently, many innovations have flowed into this area, and approaches have emerged that are increasingly becoming ready for application. This involves not only printed electronic structures, but also complete components such as chips, sensors, LEDs, or microprocessors that are additively manufactured or in which functions are integrated using 3D printing. We want to present these developments to the audience in Erfurt.

What role does the collaboration with the 3D-MID research association play in this? 
    
We have had good contacts with the Research Association for Mechatronic Integrated Components for many years. We've now taken our collaboration to a new level and are delighted that the association is now an official partner and helping to shape the forum.

What topics are on the agenda?
    
We're covering a wide range and highlighting the diversity of possible applications. The topics range from current developments in the field of mechatronic integrated assemblies to 3D printing of technical plastic parts such as coil formers for electrical engineering, additive manufacturing with dielectric materials, e.g., for high-frequency technology, flexible and printed photovoltaics for integrated applications, and 3D printing for ultra-fine connection technology in the micrometer range.

What makes rapid.tech 3D so appealing to you?
    
The specialist conference, exhibition, and networking formats such as the Technical Deep Dives tours offer excellent opportunities to acquire new knowledge and contacts in a short time and to benefit from the experience of an excellent network of experts.